Paragraph 1.03 of the Foreign Trade Policy (FTP) 2023, as amended from time to time, the Director General of Foreign Trade (DGFT) has notified a new Standard Input-Output Norms (SION) entry with serial number C-2049.
The newly introduced SION pertains to the export item “Mobile Phone” under the Engineering & Electronic Items category.
Key Points:
- New SION Introduced: SION C-2049 has been added for the export product Mobile Phone.
- Category Covered: Falls under Engineering & Electronic Items.
- Authority Empowered: Regional Authorities (RAs) can now issue Advance Authorisation directly under this SION.
- Purpose:
- To expedite authorisation issuance without requiring case-by-case reference to the Norms Committee.
- To ensure uniformity and consistency in the application of norms across regions.
- Effective Date: The notification is effective immediately upon issuance.
Effect of this Public Notice:
A new Standard Input Output Norm (SION C-2049) has been notified for Mobile Phone exports to facilitate faster clearances and streamlined authorisation processes, promoting efficiency within the Engineering & Electronics sector.
Table:
SION C- 2049 | Item Of Export | Quantity | Item Of Import | Quantity Allowed |
Mobile Phones | 1 No. | Accelerometer sensor | Net-to-Net | |
Acoustic Filter | Net-to-Net | |||
Backlight LED driver chip | Net-to-Net | |||
BTB Connector | Net + 1% | |||
BTB battery connector | Net + 1% | |||
Cable Clamp_Connector | Net-to-Net | |||
Cable Connector | Net + 1% | |||
Camera Conductive foam | Net + 1% | |||
Camera lens | Net-to-Net | |||
Camera Module | Net-to-Net | |||
Capacitor | Net + 1% | |||
Ceramic Filter | Net-to-Net | |||
Chip Bead | Net-to-Net | |||
Chip capacitor | Net-to-Net | |||
Chip Ceramic Capacitor | Net-to-Net | |||
DUP | Net-to-Net | |||
Earphone Jack | Net-to-Net | |||
eMMC | Net-to-Net | |||
EP Jack Sleeve rubber | Net + 1% | |||
ESD Suppressor | Net + 1% | |||
FPC assembly | Net-to-Net | |||
FPC LED | Net-to-Net | |||
FPC SIDE KEY | Net-to-Net | |||
Geomagnetic sensor | Net-to-Net | |||
IC Audio amplifier Class D | Net-to-Net | |||
IC Operational Amplifier | Net-to-Net | |||
IC PAMiD | Net-to-Net | |||
IC RF Switch | Net-to-Net | |||
(IC)Platform Power Management Chip | Net-to-Net | |||
(IC)WIFI/BT WCN Master Chip | Net-to-Net | |||
IC Switch Charge Mangament Chip | Net-to-Net | |||
IC USB Switch | Net-to-Net | |||
Inductor | Net + 1% | |||
LCM cushioning foam | Net + 1% | |||
LDO | Net-to-Net | |||
LDO Chip | Net-to-Net | |||
Light distance sensor | Net-to-Net | |||
Light sensor | Net-to-Net | |||
L-PAMID | Net-to-Net | |||
Machine screw | Net + 1% | |||
MLC capacitor | Net + 1% | |||
MMMBPА | Net-to-Net | |||
Multi-Layer Inductor | Net-to-Net | |||
mylar_LCM FPC hole seal Mylar | Net-to-Net | |||
mylar_PET_MYLAR | Net-to-Net | |||
mylar_waterproof | Net-to-Net | |||
Needle | Net-to-Net | |||
NMOS Transistor | Net-to-Net | |||
PCB Sub-board | Net-to-Net | |||
PCB V3 | Net-to-Net | |||
Platform Baseband Chip | Net-to-Net | |||
POWER BTB Connector | Net + 1% | |||
Power Inductor | Net-to-Net | |||
Power Management Chip | Net-to-Net | |||
Receiver | Net-to-Net | |||
Resistor | Net + 1% | |||
RF transceiver | Net-to-Net | |||
RF LNA | Net-to-Net | |||
RF LNA Bank | Net-to-Net | |||
RF Switch Connector | Net-to-Net | |||
Rubber sleeve | Net + 1% | |||
RX Filter | Net-to-Net | |||
RX_SAW/BAW_FILTER | Net-to-Net | |||
screw_Metric size_flat head | Net-to-Net | |||
Sensor Sleeve rubber | Net + 1% | |||
SMD shrapnel | Net + 1% | |||
SMT shielding | Net + 1% | |||
SMT shrapnel | Net + 1% | |||
speaker | Net-to-Net | |||
Speaker Bracket Metal | Net-to-Net | |||
Thermal conductivity silicone | Net + 1% | |||
Thermistor | Net + 1% | |||
TPU | Net + 1% | |||
Transceiver filter | Net-to-Net | |||
TRX Filter | Net-to-Net | |||
TVS_1-Channel | Net-to-Net | |||
TX_SAW/BAW_FILTER | Net-to-Net | |||
USB TYPE C Connector | Net-to-Net | |||
Vibration motor | Net-to-Net |
Notification Reference: DGFT
Public Notice No. 25 /2025-26
10 /10 /2025
https://shorturl.fm/Yf9fr
https://shorturl.fm/Pf5Cq